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RADIATION SENSITIVE RESIN COMPOSITION FOR FORMING WIRING PARTITION, WIRING PARTITION, AND ITS FORMING METHOD

机译:用于形成布线分区的辐射敏感树脂组合物,布线分区及其形成方法

摘要

PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition for forming wiring partitions having sufficient resolution, wide exposure margin, and excellent flattening performance, maintaining high transparency even when being passed through a high temperature heating process and hardly secularly deteriorating metal wiring.;SOLUTION: The radiation sensitive resin composition contains (A) polysiloxane obtained by poly-condensing (a-1) 50-99 wt.% of an alkoxy silane compound having an aryl group, (a-2) 1-45 wt.% of a silane compound having an alkyl group, and (a-3) 0-5 wt.% of the other alkoxy silane compound, and (B) a compound generating acid by receiving irradiation of radiation.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种用于形成布线间隔壁的放射线敏感性树脂组合物,该组合物具有足够的分辨率,宽的曝光余量和优异的平坦化性能,即使经过高温加热过程且几乎不会使金属布线长期变质,仍保持高透明度。溶液:辐射敏感性树脂组合物包含(A)通过缩聚(a-1)50-99 wt%的具有芳基的烷氧基硅烷化合物,(a-2)1-45 wt%的聚硅氧烷获得的聚硅氧烷。一种具有烷基的硅烷化合物,以及(a-3)0-5 wt%的另一种烷氧基硅烷化合物,以及(B)一种通过辐射辐照产生酸的化合物。;版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010008603A

    专利类型

  • 公开/公告日2010-01-14

    原文格式PDF

  • 申请/专利权人 JSR CORP;

    申请/专利号JP20080166500

  • 发明设计人 HANAMURA MASAAKI;KINOSHITA YOSHINORI;

    申请日2008-06-25

  • 分类号G03F7/075;G03F7/004;G03F7/40;C08G77/14;H01L51/50;G09F9/30;G09F9/00;G02F1/1368;

  • 国家 JP

  • 入库时间 2022-08-21 19:04:43

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