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ROLL CORE AND WAFER PROCESSING TAPE WOUND AROUND THE ROLL CORE

机译:卷芯和晶圆加工带绕卷芯缠绕

摘要

PPROBLEM TO BE SOLVED: To provide a roll core for winding a wafer processing tape having an adhesive layer and an adhesive film on a release film, the roll core capable of sufficiently suppressing the occurrence of a transfer mark in the adhesive layer when the wafer processing tape is wound into a rolled form. PSOLUTION: The wafer processing tape includes a release film 31, an adhesive layer 32 having a predetermined planar shape provided on the surface of the release film, and an adhesive film 33 which has a label part 33a having a predetermined planar shape provided so as to cover the adhesive layer and contact the release film around the adhesive layer and a peripheral part 33b provided so as to surround the outside of the label part. The roll core 10 for winding the wafer processing tape into a rolled form has a relieving part 11 which is formed in a position corresponding at least to the adhesive layer and relieves winding pressure and a supporting part 12 which is formed in the width direction of the wafer processing tape to be wound and in the outside of the relieving part and supports the wafer processing tape. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:为了提供一种卷芯,该卷芯用于在剥离膜上卷绕具有粘合剂层和粘合膜的晶片处理带,该卷芯能够充分地抑制在粘合层上出现转印痕迹。晶片处理带被卷绕成卷状。

解决方案:晶片处理带包括离型膜31,设置在该离型膜的表面上的具有预定平面形状的粘合层32,以及具有设置有具有预定平面形状的标签部分33a的粘合膜33。覆盖粘接剂层,使剥离膜与粘接剂层的周围接触,并以包围标签部的外侧的方式设置周缘部33b。用于将晶片处理带卷绕成卷状的辊芯10具有在至少与粘接剂层相对应的位置上形成的缓和卷绕压力的缓和部11,以及在其宽度方向上形成的支承部12。晶片处理带缠绕在释放部分的外部并支撑晶片处理带。

版权:(C)2010,日本特许厅&INPIT

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