COATING PROCESSING METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, AND COATING PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To uniformly apply a coating liquid in a substrate surface while adjusting the position of a coating nozzle in a horizontal direction in a short time.;SOLUTION: The coating liquid is supplied onto a wafer for inspection from the coating nozzle and diffused (stage S1). An image of the coating liquid being diffused is acquired (stage S2). The acquired image is compared with a comparison image (stage S3) and the horizontal position of the coating nozzle is grasped from the relation between the comparison image and the horizontal position of the coating nozzle. The horizontal position of the coating nozzle is adjusted based upon the grasped position of the coating nozzle (stage S4). Thereafter, the coating liquid is supplied from the position-adjusted coating nozzle to the center of the wafer to be uniformly applied over the wafer (stage S5).;COPYRIGHT: (C)2010,JPO&INPIT