首页> 外国专利> TRANSPARENT CONDUCTIVE FILM ENCAPSULATING MESH-LIKE STRUCTURE FORMED FROM METAL MICROPARTICLES, SUBSTRATE ON WHICH TRANSPARENT CONDUCTIVE FILM IS LAMINATED, AND METHOD FOR PRODUCING THE SAME

TRANSPARENT CONDUCTIVE FILM ENCAPSULATING MESH-LIKE STRUCTURE FORMED FROM METAL MICROPARTICLES, SUBSTRATE ON WHICH TRANSPARENT CONDUCTIVE FILM IS LAMINATED, AND METHOD FOR PRODUCING THE SAME

机译:透明导电膜,包封由金属微粒形成的网状结构,将透明导电膜层压的基质及其制备方法

摘要

PPROBLEM TO BE SOLVED: To provide a transparent conductive film encapsulating a mesh-like structure formed from metal microparticles with high transmittance and high conductivity with a flat surface and excellent in heat resistance and weather resistance, as well as a substrate on which the transparent conductive film is laminated, and to provide a manufacturing method of the substrate. PSOLUTION: As shown in Fig.1, the transparent conductive film 4 is an oxide film mainly composed of silicon oxide encapsulating the mesh-like structure 1 formed from the metal microparticles. Further, the transparent conductive film is laminated on a glass substrate 11 or a ceramic substrate to obtain the substrate on which the transparent conductive film is laminated. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:提供一种透明导电膜,该透明导电膜封装由具有高透射率和高导电性且具有平坦表面并且耐热性和耐候性优异的金属微粒形成的网状结构的透明导电膜,以及其上的基板层叠透明导电膜,以提供基板的制造方法。

解决方案:如图1所示,透明导电膜4是主要由氧化硅构成的氧化物膜,其封装由金属微粒形成的网状结构1。另外,将透明导电膜层叠在玻璃基板11或陶瓷基板上,从而得到层叠有透明导电膜的基板。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP2010165638A

    专利类型

  • 公开/公告日2010-07-29

    原文格式PDF

  • 申请/专利权人 TODA KOGYO CORP;FUJICOPIAN CO LTD;

    申请/专利号JP20090009136

  • 发明设计人 KAKIHARA YASUO;SUZUKI KYOICHI;

    申请日2009-01-19

  • 分类号H01B5/14;H01B13;B32B7/02;B32B18;

  • 国家 JP

  • 入库时间 2022-08-21 19:04:21

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