首页> 外国专利> HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET

HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET

机译:切成叠层陶瓷板的热敏压敏胶板及切成叠层陶瓷板的方法

摘要

PPROBLEM TO BE SOLVED: To provide a heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet, which exhibits sufficient pressure-sensitive adhesiveness upon cut-processing at room temperature and under a high-temperature atmosphere and is easily peeled by heating upon peeling. PSOLUTION: The heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet has such a composition that a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesion-imparting resin is formed on at least one side surface of a substrate and is used for temporary fixing upon cutting of a laminated ceramic sheet, wherein a gel fraction of the heat-expandable pressure-sensitive adhesive layer is 50 wt.% or more, an acid value of a base polymer of a pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer is 350 mg-KOH/g or less and an acid value of the pressure-sensitive adhesion-imparting resin in the heat-expandable pressure-sensitive adhesive layer is 80 mg-KOH/g or less. The base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer is preferably an acryl-based polymer. Further, the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer preferably contains a crosslinking agent. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:提供一种用于切割层压陶瓷片的可热剥离的压敏胶粘片,该胶粘片在室温和高温气氛下进行切割加工时表现出足够的压敏胶粘性,并且容易剥离通过剥皮加热。

解决方案:用于切割层压陶瓷片的热剥离压敏胶粘片具有这样的组成:在至少一个侧面上形成了包含压敏胶粘赋予树脂的热膨胀压敏胶粘剂层。基材,用于切割层压陶瓷片时的临时固定,其中热膨胀性压敏胶粘剂层的凝胶分数为50 wt。%或更高,压敏基础聚合物的酸值形成热膨胀性粘合剂层的感光性粘合剂为350mg-KOH / g以下,热膨胀性粘合剂层中的赋予粘合性的树脂的酸值为80mg-KOH /。克或更少。形成热膨胀性粘合剂层的粘合剂的基础聚合物优选为丙烯酸类聚合物。此外,形成热膨胀性粘合剂层的粘合剂优选含有交联剂。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP2010214947A

    专利类型

  • 公开/公告日2010-09-30

    原文格式PDF

  • 申请/专利权人 NITTO DENKO CORP;

    申请/专利号JP20100036010

  • 申请日2010-02-22

  • 分类号B28B11/14;C09J7/02;C09J133/04;C09J11/06;

  • 国家 JP

  • 入库时间 2022-08-21 19:04:16

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