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BOARD ENCLOSING MEANS

机译:董事会封闭手段

摘要

PROBLEM TO BE SOLVED: To provide a board enclosing means for electromagnetic shielding of an electronic circuit board, which is compact and light-weight and does not lose a shielding property even if it is rubbed during manufacturing.;SOLUTION: There are provided board enclosing means 10a and 10b for electromagnetic shielding of the electronic circuit board 30. Each of the board enclosing means is a molded body of a conductive woven cloth 11 that is a metal-plated resin woven cloth. The molded body is preferably formed by, for example, pneumatic molding by which a thin and light-weight molded body is manufactured at a low cost.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种用于电子电路板的电磁屏蔽的板封装装置,其紧凑且重量轻并且即使在制造过程中被摩擦也不会失去屏蔽性能。;解决方案:提供了一种板封装装置用于对电子电路板30进行电磁屏蔽的装置10a和10b。每个板封闭装置是导电编织布11的模制体,该导电编织布11是镀金属的树脂编织布。成型体优选通过例如气动成型法形成,该成型法以低成本制造薄且轻的成型体。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010171192A

    专利类型

  • 公开/公告日2010-08-05

    原文格式PDF

  • 申请/专利权人 DENSO CORP;

    申请/专利号JP20090012214

  • 发明设计人 KUROKAWA KAZUMASA;

    申请日2009-01-22

  • 分类号H05K9/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:03:21

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