The polyhydric phenol compound which it reacts polyhydric phenol compound and epoxy resin, the thermosetting metaplasia resin

摘要

PROBLEM TO BE SOLVED: To provide a thermally set resin having high adhesion to the substrate material and shows high toughness, provide insulation materials for electric and electronic parts (for example, high-reliability semiconductor-sealing material and the like) and provide a thermally setting resin composition that is very useful, when it is used in a variety of composite materials including CFRP, adhesives, paints and the like.;SOLUTION: An aliphatic polyhalogen compound is allowed to react with a hydroxybenzaldehyde and an aminophenol and the resultant polyhydric phenols are reacted with an epihalohydrin to synthesize epoxy resins. The resultant polyhydric phenols and the epoxy resin therefrom are used in the objective curing resin composition.;COPYRIGHT: (C)2001,JPO