Being the device and the mannered null solder ball restoration device restoration

摘要

An apparatus and method for filling a ball grid array template is disclosed. The apparatus comprises a base plate rotatably mounted at the axis thereof to a controlling device and the ball grid array template being mounted onto the base plate so that the template rotates simultaneously with the base plate; a ball supply bin slidably mounted over the top surface of the base plate while being rotated together with the base plate and the ball grid template about the axis of the base plate, and the ball supply bin being substantially rectangular and enclosed on three vertical sides while the fourth vertical side proximity to the ball grid array template being a ball gate, said ball gate pivoted about the axis thereof and being normally rested by a stop pin or a like, such as a stopping edge positioned at the lower surface of the ball gate; a sensing device positioned at both the ends of the base plate at a height similar to the height of the ball gate from the base plate for monitoring the opened/closed position of the ball gate; and a plurality of small solder balls enclosed by the ball supply bin. The present invention also relates to a method of filling solder balls onto the ball grid template employed the apparatus.