For efficiency improvement the composition which includes the silica bulking agent which was heat-treated

摘要

The hardening possible resin and as for the hardening possible composition which includes the silica bulking agent which was heat-treated, when it uses, as the under filling material in the semiconductor package the flow quality which is improved, the decrease of CTE, and increase of modulus are offered, decrease of the curvature is brought. In one feature, the hardening possible composition the gluing accelerator and/or includes the penetrant (a) the silica bulking agent which was heat-treated, (b) the hardening possible resin, (c) initiator, and (d) due to when. The hardening possible resin, the cyanic acid ester resin, the epoxy resin, the maleimide resin or can be the acrylate or methacrylate resin.