OPTICAL ELEMENT, OPTICAL ELEMENT WAFER, OPTICAL ELEMENT WAFER MODULE, OPTICAL ELEMENT MODULE, METHOD OF MANUFACTURING OPTICAL ELEMENT MODULE, ELECTRONIC ELEMENT WAFER MODULE, METHOD OF MANUFACTURING ELECTRONIC ELEMENT MODULE, ELECTRONIC ELEMENT MODULE, AND ELECTRONIC INFORMATION DEVICE

摘要

PPROBLEM TO BE SOLVED: To suppress variations in the lens thickness of a lens wafer. PSOLUTION: In lens support plates 61C, 62C, a separate through-hole 68 (and/or a recess) for allowing a transparent lens resin material to escape, when forming resin is provided at a further outer-peripheral section of a spacer section at the outer-peripheral side of a through-hole passing through a lens region (optical surface A), thus allowing the transparent lens resin material to escape to the side of the through-hole 68 (and/or a recess), even when the amount of resin in the transparent lens resin material is large, when forming resin, and hence suppressing increase in the surface pressure at pressing by a mold. PCOPYRIGHT: (C)2010,JPO&INPIT