OPTICAL ELEMENT, OPTICAL ELEMENT WAFER, OPTICAL ELEMENT WAFER MODULE, OPTICAL ELEMENT MODULE, METHOD OF MANUFACTURING OPTICAL ELEMENT MODULE, ELECTRONIC ELEMENT WAFER MODULE, METHOD OF MANUFACTURING ELECTRONIC ELEMENT MODULE, ELECTRONIC ELEMENT MODULE, AND ELECTRONIC INFORMATION DEVICE

摘要

PPROBLEM TO BE SOLVED: To provide an optical element wafer, or the like, capable of further shielding light with respect to even a lateral direction, after the manufacturing of modules. PSOLUTION: A lens support plate 61C, which includes one or a plurality of through-holes passing through only a lens region (optical surface A), is provided in a first lens wafer 65B, and a lens support plate 62C, which includes one or a plurality of through-holes passing through only the lens region (optical surface A), is provided in a second lens wafer 66B. The lens support plates 61C, 62C are black and can shield light. An outer-peripheral section side (projecting section) of the through-holes of the lens support plates 61C, 62C is positioned inside projections 61a, 61b and projections 62a, 62b as spacer sections. An outer-peripheral section side (projecting section) of through-holes for a lens is constituted to be thicker than the outer-peripheral section side (step part). PCOPYRIGHT: (C)2010,JPO&INPIT