In both sides of first formation and

摘要

PROBLEM TO BE SOLVED: To provide a method for solving problems such as cracks and extra solder adhesion that arise in a formed conductive bump because it is difficult to drop only one conductive ball in a mask opening without fail and remove surplus conductive balls when conductive balls are fixed at electrodes by a squeegee in forming conductive bumps with the conductive balls.;SOLUTION: Metal layers are laminated in an area excluding basic patterns at both sides of a conductive substrate having multiple iterative basic patterns composed of opening groups through which conductive balls pass.;COPYRIGHT: (C)2005,JPO&NCIPI