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Silane-modified epoxy resin having no unsaturated bond, and the semi-cured material and the cured product obtained from the resin-containing composition

机译:没有不饱和键的硅烷改性环氧树脂以及由该含树脂组合物得到的半固化物和固化物

摘要

PROBLEM TO BE SOLVED: To obtain a silane-modified epoxy resin containing no unsaturated bond, which provides an epoxy resin-silica hybrid cured material having high heat resistance, insulation properties, adhesivity and colorless transparency, a semicured material and a cured material obtained from a composition comprising the resin.;SOLUTION: The methoxy group-containing silane modified epoxy resin is obtained by a methanol removal condensation reaction between a hydroxy group-containing epoxy resin (1) having no unsaturated bond and a methoxysilane partial condensate (2).;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:为了获得不含不饱和键的硅烷改性环氧树脂,其提供了具有高耐热性,绝缘性,粘附性和无色透明性的环氧树脂-二氧化硅杂化固化材料,半固化材料和由解决方案:含甲氧基的硅烷改性环氧树脂是通过不具有不饱和键的含羟基的环氧树脂(1)与甲氧基硅烷部分缩合物(2)之间的甲醇去除缩合反应获得的。 ;版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4399764B2

    专利类型

  • 公开/公告日2010-01-20

    原文格式PDF

  • 申请/专利权人 荒川化学工業株式会社;

    申请/专利号JP20030118134

  • 发明设计人 竹内 猛;合田 秀樹;

    申请日2003-04-23

  • 分类号C08G59/14;C08G59/20;C08G77/38;

  • 国家 JP

  • 入库时间 2022-08-21 18:59:11

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