The electronic parts being implemented with respect to electronic parts implemental

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting structure capable of enhancing junction strength between an electronic component and a substrate.;SOLUTION: A wiring pattern 2 having a land portion 3 and a resist layer 4 having an opening 4a are formed on an insulation substrate 1, and the land portion 3 is exposed from the opening 4a. An electrode portion 6 of the electronic component 5 is bonded by solder on the land portion 3. An adhesive layer 8 spreads around the electronic component 5, and the adhesive layer 8 is formed so as to be superimposed on the resist layer 4. The adhesive layer 8 and the resist layer 4 are formed of the same kind of materials. Thus, a binding force of the resist layer 4 and the adhesive layer 8 can be enhanced, and as a result, junction strength between the electronic component 5 and the insulation substrate 1 can be enhanced.;COPYRIGHT: (C)2007,JPO&INPIT