The production mannered null alkaline fusibility resin of semiconductor equipment and the indicating element, and semiconductor equipment and the indicating element which use the positive die photosensitive resin constituent and said positive

摘要

PPROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity, capable of being patterned without scum and excellent in uniformity in film thickness and to provide a semiconductor device and a display device using the same. PSOLUTION: In the positive-working photosensitive resin composition comprising an alkali-soluble resin (A), a photosensitive diazoquinone compound (B) and two or more mixed solvents (C), the mixed solvents (C) contain a solvent comprising γ-butyrolactone and a propylene glycol monoalkyl ether in an amount of ≥70 wt.% of the total amount of the solvents. PCOPYRIGHT: (C)2005,JPO&NCIPI