In the liquefied bisphenol F die epoxy resin where preparation mannered null viscosity

摘要

PROBLEM TO BE SOLVED: To provide a preparation method for a varnish composition for producing a laminate and a prepreg for an electrical circuit board by homogeneously dispersing core-shell type polymer particles in the state of primary particles without causing agglomeration.;SOLUTION: This preparation method for a varnish composition comprises dispersing core-shell type polymer particles having cores formed from a rubbery polymer in a resin having a viscosity of 2,000 mPas or lower at 60°C or lower in the substantial absence of an organic solvent and mixing the resultant dispersion with a thermosetting resin to core this thermosetting resin.;COPYRIGHT: (C)2003,JPO