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Through the 1st earth

机译:穿越第一世界

摘要

PROBLEM TO BE SOLVED: To provide a high frequency circuit board wherein reduction in a radiation gain of a high frequency signal emitted from a radiation element can be suppressed to provide a higher radiation gain.;SOLUTION: The high frequency circuit board comprises a high frequency line board 11 formed thereon with a signal line 12; a power distribution line board 7 laminated on the board 11 via a first ground conductor 5b, and formed with a power distribution line 6 including a T-branch; a radiation element board 3 laminated on the board 7 via a second ground conductor 5a, and formed with a radiation element 2; a first transmission section 4b for electromagnetically connecting the signal line 12 to the power distribution line 6; and a second transmitter 4a for electromagnetically connecting the radiation element 2 to the power distribution line 6. A plurality of connection conductors 10 arranged in parallel with second and third line conductors 9a, 9b are formed to an opposite side to a first line conductor 8, while sandwiching the second and third line conductors 9a, 9b in a way of electrically interconnecting the first and second ground conductors 5b, 5a.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种高频电路板,其中可以抑制从辐射元件发射的高频信号的辐射增益的降低,以提供更高的辐射增益。解决方案:高频电路板包括高频线路板11上形成有信号线12。配电线板7经由第一接地导体5b层叠在基板11上,并形成有包括T型分支的配电线6。辐射元件板3经由第二接地导体5a层叠在基板7上,并形成有辐射元件2。第一传输部分4b,用于将信号线12电磁连接到配电线6。第二发射器4a和第二发射器4a用于将辐射元件2电磁地连接到配电线6。与第二和第三线导体9a,9b平行布置的多个连接导体10形成在第一线导体8的相对侧。同时以将第一和第二接地导体5b,5a电互连的方式将第二和第三线导体9a,9b夹在中间;版权:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP4557751B2

    专利类型

  • 公开/公告日2010-10-06

    原文格式PDF

  • 申请/专利权人 京セラ株式会社;

    申请/专利号JP20050061932

  • 发明设计人 田淵 智也;

    申请日2005-03-07

  • 分类号H01L23/12;H01Q21/06;H01P5/12;

  • 国家 JP

  • 入库时间 2022-08-21 18:58:19

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