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The network forma barrel where the electric patchboard

机译:网络版桶所在的电动配线架

摘要

PROBLEM TO BE SOLVED: To provide an electric wiring board which can obtain a wiring circuit, without performing a solder bonding, and to provide a method of manufacturing this.;SOLUTION: The electric wiring board is manufactured by a step of forming a network form cylinder 2, in which a plurality of conductive loop wires 1 are connected integrally in a plurality of circular direction positions, a step of forming network form sheets 3 and 4 in which the network form cylinders 2 are crushed and laminated flat in the radial direction, a step of interposing an insulating sheet 5 inside the network form sheets 3 and 4, and a step of forming defect parts 6 in the circular direction position of the conductive loops 1a of the network form sheets 3 and 4. Consequently, the electric wiring board is manufactured, and the semiconductor chip 7 can be bonded directly to the conduction loop 1a of the network form sheet 3.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种无需进行焊接即可获得布线电路的电气布线板,并提供一种制造该电气布线板的方法。解决方案:该电气布线板通过形成网状图案的步骤来制造在圆筒2中,在多个圆周方向位置上一体地连接有多条导电环形线1,形成网状薄板3和4的步骤,其中网状圆筒2在径向方向上被压扁并层压,将绝缘片材5插入到网状模板3和4内的步骤以及在网状模板3和4的导电环1a的圆形位置上形成缺陷部分6的步骤。制造半导体芯片7,并且可以将半导体芯片7直接粘合到网络模板3的传导回路1a上。版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP4496922B2

    专利类型

  • 公开/公告日2010-07-07

    原文格式PDF

  • 申请/专利权人 株式会社ジェイテクト;

    申请/专利号JP20040319041

  • 发明设计人 天羽 浩治;

    申请日2004-11-02

  • 分类号H05K1/02;H05K3/22;

  • 国家 JP

  • 入库时间 2022-08-21 18:57:58

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