On the production mannered null Al substrate surface of the finishing Al

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated Al plate for a heatsink which has a high thermal conductivity and adhesion when installed on a mounting substrate with an adhesive and can be installed on the mounting substrate easily and at a low cost, and to provide the heatsink using the surface-treated Al plate and a mounting component made by reflow-soldering the heatsink on the mounting substrate.;SOLUTION: The surface-treated Al plate is made by forming a Zn layer by substitutional plating on the surface of an Al substrate, then forming an Ni layer or both Ni and Sn layers on the Zn layer by plating, and then selectively forming a layer for improving the thermal radiation. The surface-treated Al plate is used as the heatsink. The heatsink is reflow-soldered on a circuit, etc. of the mounting substrate to fabricate the mounting component.;COPYRIGHT: (C)2006,JPO&NCIPI