According to need the 5th process which forms other

摘要

PROBLEM TO BE SOLVED: To provide a wiring substrate for mounting semiconductor, which is effective in promoting higher integration of a semiconductor device, and in the increase of the number of terminals and in achieving a narrower pitch between the terminals according to faster speed or multi-functionalization, allows semiconductor devices especially to be mounted on both sides of the substrate with high density and with high precision, and is further excellent also in reliability, and also to provide its manufacturing method, and a semiconductor package.;SOLUTION: This wiring substrate 5 for mounting semiconductor comprises an insulation film 1, wiring 2 formed in the insulation film 1, and a plurality of electrode pads 4 conductive with the wiring 2 through via-holes 3. The electrode pads 4 are formed with their surface exposing on both sides of the insulation film 1, and at least a part of the side surface of the electrode pads is buried in the insulation film 1. After the electrode pads 4 are formed on the respective two metal plates, the insulating layer and the wiring are laminated onto the electrode pads 4 and the respective metal plates, and then insulation film 1 is formed by laminating the insulating layers to each other to integrate them, and then by removing the metal plates.;COPYRIGHT: (C)2006,JPO&NCIPI