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摘要

PROBLEM TO BE SOLVED: To provide a multi-pattern wiring board easy in treatment and high in reliability of hermetic sealing etc. wherein a ceramic mother board comprises a low temperature calcined board without the possibility of its being cracked by mistake even though the thickness of the wiring board is ≤0.5 mm.;SOLUTION: The multi-pattern wiring board comprises the ceramic mother board 1 where square shaped wiring board regions 4 are arranged vertically and horizontally at the center and dummy regions 5 are formed along an outer periphery part; divided grooves 2 formed in at least one of an upper surface and a lower surface of the ceramic mother board 1 along a boundary of the wiring board regions 4, and along a boundary between the wiring board region 4 and the dummy region 5 with their opposite ends entering the dummy regions 5; a plurality of grooves 6 formed intermittently over the circumference such that they intersect extensions of the divided grooves 2 of the dummy region 5 and they are arranged in parallel to the divided groove 2 located most outside. The plurality of the grooves 6 have respective lengths longer than an interval between the adjacent divided grooves 2.;COPYRIGHT: (C)2006,JPO&NCIPI