Cooling using micro-plasma excited on transmission lines structure

摘要

One embodiment of the present invention uses transmission lines structure to excite micro-plasma. The excited micro-plasma will induce a gas flow to cool down heat sink assembly. The micro-plasma may be excited with a DC source, a RF source, or a microwave source. In one embodiment, the transmission lines structure may comprise a microstrip conductor, a stripline conductor, a conductor trace, a paired differential traces, a dielectric layer, a ground layer, a dielectric resonator, and a cavity. The transmission lines structure may have patterns to induce high electric field at local regions. The micro-plasma may be used to create local turbulence near solid surface to enhance the heat transfer efficiency.