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METHOD FOR MANUFACTURING RECTANGULAR PLATE TYPE CHIP RESISTOR AND RECTANGULAR PLATE TYPE CHIP RESISTOR

机译:矩形板状片状电阻器的制造方法

摘要

There is provided a method for manufacturing rectangular plate type chip resistors which provides easy and convenient control of resistance, and easy and low cost manufacture of rectangular plate type chip resistors having a reliable electrode structure, as well as a rectangular plate type chip resistor obtained by this method and having excellent properties particularly at low resistance. The method includes the steps of (A) providing a resistive alloy plate strip 10 of predetermined width and thickness, (B) forming an insulating protective film (11a, 11b) of a predetermined width longitudinally along the middle of upper and lower faces of the alloy plate strip, (C) forming an electrode layer 12 composed of integrated surface, back, and end electrodes (12a, 12c, 12b, respectively), along both sides of the protective film by electroplating, and (D) cutting the alloy plate strip coated with the protective films and the electrode layers in step (C) transversely in predetermined lengths, wherein resistance is controlled to be within a predetermined range by adjusting the thickness of the alloy plate strip in step (A), the width of the protective film formed in step (B), and the cutting length in step (D).
机译:提供了一种矩形板型片状电阻器的制造方法,其提供了容易和方便的电阻控制,并且容易且低成本地制造了具有可靠电极结构的矩形板型片状电阻器以及通过该方法获得的矩形板型片状电阻器。该方法具有优异的性能,特别是在低电阻下。该方法包括以下步骤:(A)提供预定宽度和厚度的电阻合金板条 10 ,(B)形成绝缘保护膜( 11 a ,11 b )沿着合金板带上下表面的中部纵向成预定宽度,(C)形成电极层 12 由集成的表面,背面和末端电极( 12 a ,12 c ,12 b )分别沿着保护膜的两侧进行电镀,并且(D)切割涂覆有保护膜的合金板条和电极层步骤(C)以预定长度横向地进行,其中通过调节步骤(A)中的合金板带的厚度,步骤(B)中形成的保护膜的宽度和切割,将电阻控制在预定范围内(D)中的长度。

著录项

  • 公开/公告号US2010176913A1

    专利类型

  • 公开/公告日2010-07-15

    原文格式PDF

  • 申请/专利权人 TATSUKI HIRANO;OSAMU MATSUKAWA;

    申请/专利号US20070376878

  • 发明设计人 TATSUKI HIRANO;OSAMU MATSUKAWA;

    申请日2007-05-18

  • 分类号H01C1/14;C25D5/02;

  • 国家 US

  • 入库时间 2022-08-21 18:55:54

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