首页> 外国专利> METHODS FOR RETAINING METAL-COMPRISING MATERIALS USING LIQUID CHEMISTRY DISPENSE SYSTEMS FROM WHICH OXYGEN HAS BEEN REMOVED

METHODS FOR RETAINING METAL-COMPRISING MATERIALS USING LIQUID CHEMISTRY DISPENSE SYSTEMS FROM WHICH OXYGEN HAS BEEN REMOVED

机译:使用去除了氧气的液体化学分配系统来保留金属材料的方法

摘要

Methods for fabricating a semiconductor device from a semiconductor substrate having a metal-comprising material and a disposable material are provided. In accordance with an exemplary embodiment, the method comprises providing a system for exposing the disposable material to a liquid chemistry and removing oxygen from the system. The disposable material is exposed to the liquid chemistry and is removed from the semiconductor substrate using the liquid chemistry and simultaneously the metal-comprising material is left substantially in tact.
机译:提供了一种由具有含金属的材料和一次性材料的半导体衬底制造半导体器件的方法。根据示例性实施例,该方法包括提供一种系统,该系统用于将一次性材料暴露于液体化学物质并从该系统去除氧气。将一次性材料暴露于液体化学物质中,并使用液体化学物质将其从半导体衬底上除去,同时将含金属的材料基本保持原样。

著录项

  • 公开/公告号US2010062609A1

    专利类型

  • 公开/公告日2010-03-11

    原文格式PDF

  • 申请/专利权人 BALGOVIND SHARMA;

    申请/专利号US20080208159

  • 发明设计人 BALGOVIND SHARMA;

    申请日2008-09-10

  • 分类号H01L21/302;

  • 国家 US

  • 入库时间 2022-08-21 18:55:52

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