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Surface-Decorated Polymeric Amphiphile Porogens for the Templation of Nanoporous Materials

机译:用于纳米孔材料模板化​​的表面装饰聚合物两亲性致孔剂

摘要

A nanoparticle which includes a multi-armed core and surface decoration which is attached to the core is prepared. A multi-armed core is provided by any of a number of possible routes, exemplary preferred routes being living anionic polymerization that is initiated by a reactive, functionalized anionic initiator and ∈-caprolactone polymerization of a bis-MPA dendrimer. The multi-armed core is preferably functionalized on some or all arms. A coupling reaction is then employed to bond surface decoration to one or more arms of the multi-armed core. The surface decoration is a small molecule or oligomer with a degree of polymerization less than 50, a preferred decoration being a PEG oligomer with degree of polymerization between 2 and 24. The nanoparticles (particle size ≦10 nm) are employed as sacrificial templating porogens to form porous dielectrics. The porogens are mixed with matrix precursors (e.g., methyl silsesquioxane resin), the matrix vitrifies, and the porogens are removed via burnout. Greater porosity reduces the dielectric constant k of the resulting dielectrics. The porous dielectrics are incorporated into integrated circuits as lower k alternatives to silicon dioxide.
机译:制备包括多臂核和附着在核上的表面装饰物的纳米颗粒。通过许多可能的途径中的任何一种来提供多臂核,示例性的优选途径是通过双-MPA树枝状大分子的反应性,官能化的阴离子引发剂和ε-己内酯聚合引发的活性阴离子聚合。多臂核心优选地在一些或全部臂上被功能化。然后采用偶联反应将表面装饰粘合到多臂型芯的一个或多个臂上。表面装饰是聚合度小于50的小分子或低聚物,优选的装饰是聚合度在2到24之间的PEG低聚物。纳米颗粒(粒径≤10nm)用作牺牲模板剂。形成多孔电介质。将致孔剂与基质前体(例如甲基倍半硅氧烷树脂)混合,使基质玻璃化,并通过烧尽除去致孔剂。更大的孔隙率降低了所得电介质的介电常数k。多孔电介质作为二氧化硅的低k替代品并入集成电路。

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