COLD PLATE APPARATUS WITH A CONTROLLED HEAT TRANSFER CHARACTERISTIC BETWEEN A METALLURGICALLY BONDED TUBE AND HEAT SINK FOR FACILITATING COOLING OF AN ELECTRONICS COMPONENT

摘要

A cold plate apparatus is provided which includes a tube formed of a first metal, a casted heat sink member formed of a second metal surrounding a heat transfer region of the tube, and an alloy layer disposed between the tube and the heat sink member. The tube has its first and second ends, with the heat transfer region being disposed between its ends. The first and second ends of the tube extend from the heat sink member, and a metallurgical bond exists between the tube and heat sink member in the heat transfer region of the tube. The alloy layer formed during casting of the heat sink member by the first metal and second metal reacting peritectically, and with the thickness of the alloy layer minimized during casting of the heat sink member to enhance the heat transfer characteristic of the metallurgical bond.