LAPPING PLATE-CONDITIONING GRINDSTONE SEGMENT, LAPPING PLATE-CONDITIONING LAPPING MACHINE, AND METHOD FOR CONDITIONING LAPPING PLATE

摘要

In a lapping machine comprising a lapping plate and a conditioning carrier disposed thereon, the carrier being provided with bores for receiving conditioning grindstone segments, the lapping plate is polished and conditioned by cooperatively rotating the lapping plate and the carrier and feeding loose abrasive grains to the lapping plate. The conditioning grindstone segment of a shape of arcuated trapezoid having an included angle of 180°-90° is fitted in the carrier bore.