首页> 外国专利> METHOD FOR SEALING A COMPLEX SHAPE ELECTRONIC SENSOR BY LOW-PRESSURE INJECTION OF REACTIVE RESIN

METHOD FOR SEALING A COMPLEX SHAPE ELECTRONIC SENSOR BY LOW-PRESSURE INJECTION OF REACTIVE RESIN

机译:低压注入反应树脂密封形状复杂的电子传感器的方法

摘要

A method of sealing, by low-pressure injection of reactive resin, an electronic sensor placed in a housing consisting of at least two attached elements, includes the following steps:i. assembly of the sensor within the elements of the housing,ii. locking of the elements of the housing, in order to form an injection jacket,iii. low-pressure injection of a reactive resin through at least one filling orifice of the injection jacket,iv. continuing injection until the reactive resin overflows into at least one overflow container provided to contain the excess reactive resin, characterized in that filling orifice(s) and overflow container(s) are incorporated in the injection jacket.
机译:一种通过低压注入反应性树脂来密封放置在由至少两个连接的元件组成的壳体中的电子传感器的方法,该方法包括以下步骤: i。 ; ii。锁定外壳的元件,以形成注射外套, iii。通过注入夹套的至少一个填充孔低压注入反应性树脂 iv。继续注入,直到反应性树脂溢流到至少一个溢流容器中为止,该溢流容器用于容纳过量的反应性树脂,其特征在于在注入夹套中装有填充孔和溢流容器。

著录项

  • 公开/公告号US2010109192A1

    专利类型

  • 公开/公告日2010-05-06

    原文格式PDF

  • 申请/专利权人 ARMAND CASTANDET;ALIX COURTADON;

    申请/专利号US20080531648

  • 发明设计人 ARMAND CASTANDET;ALIX COURTADON;

    申请日2008-03-10

  • 分类号B29C45/14;

  • 国家 US

  • 入库时间 2022-08-21 18:52:42

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