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Method for forming median crack in substrate and apparatus for forming median crack in substrate

机译:在基板中形成中位裂纹的方法和在基板中形成中位裂纹的设备

摘要

A method for forming a median crack and an apparatus for forming a median crack are provided, where the formation of a deep, straight median crack is possible, and an excellent broken surface of a brittle substrate can be gained as a result of breaking. In the method for forming a median crack in a brittle substrate, the brittle substrate is irradiated with a laser beam along a laser-scribe line to be formed with median cracks on the brittle substrate so as to be heated to a temperature that is no higher than its melting temperature, and thereby, a median crack is created along the laser-scribe line to be formed with median cracks and expanded starting from a notch that has been formed in the brittle substrate, and this method for forming a median crack in a brittle substrate is characterized in that high temperature portions that receive intense radiation from a laser beam, and low temperature portions that receive faint radiation from a laser beam are alternately formed along the laser-scribe line to be formed with median cracks.
机译:提供了一种形成中位裂纹的方法和一种用于形成中位裂纹的设备,其中可以形成深的,笔直的中位裂纹,并且由于断裂而可以得到脆性基材的优异的断裂表面。在用于在脆性基板上形成正中裂纹的方法中,沿着激光划痕线向脆性基板照射激光束,以在脆性基板上形成正中裂纹,从而将其加热至更高的温度。因此,沿着激光划痕线产生正中裂纹,形成有正中裂纹并从在脆性基板上形成的切口开始扩展,并且该方法在玻璃基板上形成正中裂纹。脆性基板的特征在于,沿着激光划痕线交替地形成从激光束接收强辐射的高温部分和从激光束接收微弱辐射的低温部分,以形成中间裂纹。

著录项

  • 公开/公告号US7723212B2

    专利类型

  • 公开/公告日2010-05-25

    原文格式PDF

  • 申请/专利权人 KOJI YAMAMOTO;NOBORU HASAKA;

    申请/专利号US20050572931

  • 发明设计人 KOJI YAMAMOTO;NOBORU HASAKA;

    申请日2005-07-29

  • 分类号H01L21;

  • 国家 US

  • 入库时间 2022-08-21 18:50:24

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