A diode-laser bar package includes two diode-laser bars mounted on a heat sink with slow-axes of the diode-laser bars aligned. Three spaced apart mounting bosses extend from the front of the heat sink. The package includes two cylindrical lens assemblies. Each lens assembly has an elongated cylindrical lens bonded to a rectangular mounting block. The cylindrical lenses are aligned with the diode-laser bars. Lateral faces of the mounting block are epoxy-bonded to lateral faces of the mounting bosses. Bonding is effected by injecting liquid epoxy between the faces to be bonded though holes extending through the mounting blocks from front to the lateral faces of the mounting blocks. The liquid epoxy is then cured to complete the attachment.
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