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Algorithm for real-time process control of electro-polishing

机译:电抛光实时过程控制算法

摘要

Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.
机译:用于电子过程的过程控制的方法和设备。该方法包括通过施加两个或更多个偏置来对晶片进行电处理,并分别确定由于每个偏置而去除的电荷量。在一个实施例中,当针对偏置移除的电荷量基本上等于针对该偏置计算的相应目标电荷时,为每个偏置确定终点。

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