A MULTILAYER SUBSTRATE TO MOUNT A DIE, A METHOD FOR MAKING A SUBSTRATE TO PACKAGE A DIE, AN ELECTRONIC ASSEMBLY, AN ELECTRONIC SYSTEM AN A DATA PROCESSING SYSTEM

摘要

To reduce switching noise, the power supply terminals 64, 66 (FIG.3) of an integrated circuit die 60 (FIG.3)are coupled to respective terminals 141, 151 of at least one embedded capacitor in a multilayer ceramic/ organic hybrid substrate 50. In one embodiment, a ceramic portion 90 of the substrate 50 includes at least one capacitor formed of a high permittivity layer 92, 93 sandwiched between conductive planes 141, 151. An organic portion 80 of the substrate includes suitable routing and fan-out of power and signal conductors 105, 115, 125. The organic portion 80 includes a build-up of multiple layers of organic material overlying the ceramic portion 90. Also described are an electronic system 1 (FIG.1), a data processing system, and various methods of manufacture (FIG.5).