METHOD OF PRODUCING TWO-LAYERED COPPER-CLAD LAMINATE, AND TWO-LAYERED COPPER-CLAD LAMINATE

摘要

ABSTRACT Provided is a method of producing a two-layered copper-cladlaminate with improved folding endurance, wherein the two-layered copper-clad laminate retains folding endurance of 150 times or more measured with a folding endurance test based on JIS C6471 by subjecting the laminate in which a copper layer is formed on a polyimide film through sputtering and plate processing to heat treatment at a temperature of 100°C or more but not exceeding175°C. Specifically, provided are a method of producing a two-layered copper-clad laminate (two-layered CCL material) in which a copper layer is formed on a polyimide film through sputtering and plate processing, wherein the rupture of the outer lead part of a circuit can be prevented due to the improvement infolding endurance; and a two-layered copper-clad laminate obtained from the foregoing method.