A resin paste for the application in a molding compound sheet, a composite thick molding or a molding compound mass comprising (a) 30 to 95 parts by weight of at least one epoxidized triglyceride having at least two epoxide groups, (b) 5 to 90 parts by weight of at least one anhydride of a polycarboxylic acid, (c) 0.001 to 10 parts by weight of a polycarboxylic acid, (d) 0.1 to 40 parts by weight of at least an epoxide compound cycloaliphatic or heterocyclic, terminal, (e) 0 to 40 parts by weight of a component comprising at least one compound selected from the group consisting of quaternary ammonium compounds, primary amines, secondary amines, carboxamides, substituted carboxamides in N, epoxidized alkoxysilanes, CH-acidic compounds and mixtures thereof.
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