COPPER SURFACE PROCESSING AGENT, SURFACE PROCESSING METHOD, AND COPPER SURFACE FILM

摘要

Disclosed is a copper surface film that can be processed to a smooth surface without increasing the number of processing steps and without a roughening process such as etching of the copper surface, and in which the adhesion between the copper and an insulating material such as resin or the like can be maintained. Said film contains an alloy of copper and tin, the weight of the tin in the copper surface film is between 1 mg/m2 and 2,000 mg/m2, and within the composition in the outermost surface of the aforementioned film, the molar ratio of copper to tin is between 0.2 and 2.0.