An apparatus for cutting floor tiles (6) of readily cuttable material comprises a guiding device (10) for guiding movement of the apparatus along a vertical wall (4) adjacent to a floor (2) being covered, a cutting device for forming a downward cut (34) across a tile (6) on the floor (2), and a tie device (18) extending from the guiding device (10) and along which the cutting device (22) is adjustable towards and away from the guiding device (10).
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