IMAGE SENSOR MODULE AND A METHOD OF MAKING THE SAME, CAPABLE OF REMOVING A HARDENING PROCESS OF AN UNDER FILL SOLUTION WITHOUT ADDITIONAL UNDER FILL PROCESS

摘要

PURPOSE: An image sensor module and a method of making the same are provided to reduce a process and improve productivity by protecting an edge of an image sensor without under fill process and a hardening process.;CONSTITUTION: In an image sensor module and a method of making the same, an image sensor chip(5) forms an imaging device on a first plane. The image sensor chip is adhered on a printed circuit board, and a lens assembly receiving a lens through which an incident light on the image device passes is combined with a first housing unit(11). A second housing unit(12) is folded and is adhered to the device to protect at least a partial edge surface(5a) of image sensor chip of the second plane opposite to the first plane. The first housing unit is made of a material including an engineering plastic series, and the first housing unit and the second housing unit are formed into one body through a double injection.;COPYRIGHT KIPO 2010