METHOD FOR PRODUCING A RESIN COMPOSITION FOR SEMICONDUCTOR ELEMENT ENCAPSULATION WHICH HAS STABILIZED PROPERTY BY SUPPRESSING THE CHANGE OF A MOLE FRACTION

摘要

PURPOSE: A method for producing a resin composition for semiconductor element encapsulation is provided to prevent the delay of components in a supply container without influences on a shape or capacity of for supply container, and to stabilize properties by suppressing the change of a mole fraction of the resin composition.;CONSTITUTION: A resin composition for semiconductor element encapsulation comprises an epoxy resin, a hardener, and an inorganic filler. A method for producing a resin composition for semiconductor element encapsulation comprises the steps of: obtaining a mixture containing epoxy resin and hardener which have an average particle diameter 5 μm - 50 μm and further containing inorganic filler; storing the mixture in a container for supplying the mixture to a melting-kneader; supplying the mixture to the melting-kneader to obtain a mixing material; and cooling and solidifying the mixing material.;COPYRIGHT KIPO 2010