首页> 外国专利> MANUFACTURING METHOD OF AN OPTICAL CIRCUIT BOARD HAVING AN INTEGRATED STRUCTURE OF AN ELECTRIC WIRING REQUIRED FOR ELECTRIC SIGNAL TRANSMISSION AND AN OPTICAL WAVEGUIDE REQUIRED FOR OPTICAL SIGNAL TRANSMISSION

MANUFACTURING METHOD OF AN OPTICAL CIRCUIT BOARD HAVING AN INTEGRATED STRUCTURE OF AN ELECTRIC WIRING REQUIRED FOR ELECTRIC SIGNAL TRANSMISSION AND AN OPTICAL WAVEGUIDE REQUIRED FOR OPTICAL SIGNAL TRANSMISSION

机译:具有电信号传输所需的电气线路和光信号传输所需的光学波导的整体结构的光学电路板的制造方法

摘要

PURPOSE: A manufacturing method of an optical circuit board is provided to improve optical contact efficient in comparison with an optical waveguide having a contact part of a square shape by convexly forming the contact part of the optical waveguide contacted with a light source.;CONSTITUTION: A pattern groove for forming an optical waveguide is formed on a first surface of a top part of a copper foil(30). A first clad(31) is coated on a part or a whole part of the first surface of the copper foil. A core(33) of the optical waveguide is formed by filling a core material(32) inside the pattern groove formed in the copper foil. The core is formed by removing the core material remaining on a surface of the copper foil except for the pattern. A second clad(34) is formed on the core. An electrode pattern(35) is formed on a second surface of the copper foil by partially removing the second surface of the copper foil. Thickness of the electrode is reduce by half-etching the copper foil.;COPYRIGHT KIPO 2010
机译:目的:提供一种光电路板的制造方法,与具有正方形接触部分的光波导相比,通过凸出形成与光源接触的光波导的接触部分,以提高光接触效率。在铜箔(30)的顶部的第一表面上形成有用于形成光波导的图案槽。第一覆层(31)被涂覆在铜箔的第一表面的一部分或整个部分上。通过将芯材料(32)填充在形成于铜箔中的图案凹槽内来形成光波导的芯(33)。通过除去除图案以外残留在铜箔的表面上的芯材来形成芯。在芯上形成第二包层(34)。通过部分地去除铜箔的第二表面,在铜箔的第二表面上形成电极图案(35)。通过半蚀刻铜箔可减小电极的厚度。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20090122502A

    专利类型

  • 公开/公告日2009-12-01

    原文格式PDF

  • 申请/专利权人 DOOSAN CORPORATION;

    申请/专利号KR20080048353

  • 发明设计人 CHO KYEONG WOON;PARK IN SOO;JEON KEUM SOO;

    申请日2008-05-26

  • 分类号G02B6/12;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:59

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