copper circuit pattern of the double injection method of transmitting and receiving devices , such as housing , nickel-plated , gold-plated antenna function with the method

摘要

A manufacturing method of antenna function using copper plating, nickel plating, and gold plating in circuit pattern is provided to perform antenna function in an inner surface or an inner part of a transmitting and receiving housing. Base material is PBT(PolyButylene Terephthalate), PA(PolyAmide), or PPS(PolyPhenylene Sulfide) resin. A housing part or an insertion part of a cell phone or a wireless device is injected by molding LCP(Liquid Crystal Polymer) and SPS(Syndiotactic PolyStyrene) resin(1). A free etching process is performed(2). A bath cleaning process is performed(3). An etching process is performed in order to form a micro pore on a surface(5). A catalyst is absorbed in the micro pore(11). A catalyst reaction is activated by an accelerator process(13). An electro less copper plating process is performed(16). A copper plating surface is activated by a catalyst activated process(18). A nickel metal film is formed by an electro less nickel plating process(19).