DEVICE AND A METHOD FOR FORMING A FILM, CAPABLE OF FLOWING COOLING GAS TO A RECTIFICATION PLATE BY INCLUDING A PENETRATION HOLE ON THE RECTIFICATION PLATE

摘要

PURPOSE: A device and a method for forming a film are provided to cool down a rectification plate using a penetration hole of the rectification plate.;CONSTITUTION: A rectification plate is installed to an upper side of a reactive gas flowing direction on a silicon wafer(101). The rectification plate includes a first penetration hole(104a) and a second penetration hole(104b) installed on a position where the first penetration hole does not cross. The reactive gas flows to the silicon wafer by passing through the first penetration hole. The temperature rise of the rectification is suppressed by passing the cooling gas through the second penetration hole.;COPYRIGHT KIPO 2010