IN-LINE BUFFER AND A SEMICONDUCTOR CHIP-PACKING SYSTEM INCLUDING THE SAME, CAPABLE OF INCREASING THE MANUFACTURING EFFICIENCY OF A FLEXIBLE PCB

摘要

PURPOSE: An in-line buffer and a semiconductor chip-packing system including the same are provided to reduce unnecessary manufacturing time and storage place by serially connecting two processing apparatuses.;CONSTITUTION: A first buffer(31) includes a first hold space(32) and transfers a substrate film by engaging the substrate film. A second buffer(38) includes a second and a third hold spaces(39, 40) and transfers the substrate film by engaging the substrate film. Buffering sensors(48, 49, 54, 59) are senses the holding status in the hold spaces. A control unit(80) controls one of the first buffer and the second buffer and transfers the substrate film according the holding status.;COPYRIGHT KIPO 2010