首页> 外国专利> THERMOPLASTIC RESIN COMPOSITION CAPABLE OF REDUCING THE EMISSION AMOUNT OF TOTAL VOLATILE ORGANIC COMPOUNDS BY INCLUDING A POROUS SILICA NANO PARTICLE

THERMOPLASTIC RESIN COMPOSITION CAPABLE OF REDUCING THE EMISSION AMOUNT OF TOTAL VOLATILE ORGANIC COMPOUNDS BY INCLUDING A POROUS SILICA NANO PARTICLE

机译:通过包含多孔二氧化硅纳米粒子能够降低总挥发性有机化合物排放量的热塑树脂成分

摘要

PURPOSE: A thermoplastic resin composition is provided to secure the impact strength, and the mechanical property including the flowage and heat resistance, and to prevent environment contamination by reducing the generation of total volatile organic compounds.;CONSTITUTION: A thermoplastic resin composition contains 100 parts of base resin by weight, and 0.1~5 parts of porous silica nano particle by weight. The base resin is formed with 30~99 parts of styrene-based resin including an epoxy group by weight, and 1~70 parts of polyester resin. The average particle size of the porous silica nano particle is 5~800 nano meters. The average diameter of each pore is 1~80 nano meters. The styrene-based resin contains 5~100wt% of epoxy radical including vinyl copolymer, and 0~95wt% of rubber strengthening styrenic copolymer resin.;COPYRIGHT KIPO 2010
机译:目的:提供一种热塑性树脂组合物,以确保冲击强度以及包括流动性和耐热性在内的机械性能,并通过减少总挥发性有机化合物的产生来防止环境污染。;组成:热塑性树脂组合物包含100份重量的基础树脂,和0.1-5重量份的多孔二氧化硅纳米颗粒。基础树脂由30〜99重量份的具有环氧基的苯乙烯基树脂和1〜70重量份的聚酯树脂形成。多孔二氧化硅纳米粒子的平均粒径为5〜800纳米。每个孔的平均直径为1〜80纳米。苯乙烯基树脂包含5〜100wt%的含乙烯基共聚物的环氧基和0〜95wt%的橡胶增强苯乙烯共聚物树脂。; COPYRIGHT KIPO 2010

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