首页> 外国专利> MOLD SETTING DEVICE FOR A PRESS, CAPABLE OF SETTING THE ADHESION FORCE OF AN UPPER MOLD ON A LOWER MOLD PUNCH

MOLD SETTING DEVICE FOR A PRESS, CAPABLE OF SETTING THE ADHESION FORCE OF AN UPPER MOLD ON A LOWER MOLD PUNCH

机译:压力机的模具设定装置,能够设定下模冲头上模的附着力

摘要

PURPOSE: A mold setting device for a press is provided to prevent the partial burst of a product due to an adhesion force defect and unbalanced molds by determining the pressure balance of each part between a lower mold punch and an upper mold.;CONSTITUTION: A mold setting device for a press comprises a multiple pressure sensor(S1,S2), a controller(C), and a display(15). Multiple pressure sensors are installed at the edge of a die face(F1) of a blank holder(7). The pressure sensor outputs signals by measuring the pressing pressure of an upper mold in respect to the blank holder due to the descending motion of the upper mold(11). The control logic determines the pressure balance of each part between a lower mold punch(1) and an upper mold. The display displays the pressure balance signals outputted from the controller to an operator.;COPYRIGHT KIPO 2010
机译:目的:提供一种用于压机的模具设定装置,通过确定下模具冲头和上模具之间的每个部分的压力平衡,来防止由于粘附力缺陷和不平衡模具而导致的产品局部爆裂。组成:A压力机的模具设定装置包括多个压力传感器(S1,S2),控制器(C)和显示器(15)。多个压力传感器安装在毛坯支架(7)的模具表面(F1)的边缘。压力传感器通过测量由于上模具(11)的下降运动而相对于坯料保持器的上模具的压力来输出信号。控制逻辑确定下模具冲头(1)和上模具之间的每个部分的压力平衡。显示屏显示从控制器输出到操作员的压力平衡信号。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100075150A

    专利类型

  • 公开/公告日2010-07-02

    原文格式PDF

  • 申请/专利权人 SUNG WOO HITECH CO. LTD.;

    申请/专利号KR20080133774

  • 发明设计人 LEE MUN YONG;SOHN SUNG MAN;YOON JI HONG;

    申请日2008-12-24

  • 分类号B30B15/14;B30B15/16;B30B15/02;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:21

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