首页> 外国专利> METHOD FOR FORMATION OF A BURIED GATE ELECTRODE, CAPABLE OF SECURING LOW RESISTANCE OF A WORD LINE BY INCREASING THE RELIABILITY OF A GATE OXIDE FILM

METHOD FOR FORMATION OF A BURIED GATE ELECTRODE, CAPABLE OF SECURING LOW RESISTANCE OF A WORD LINE BY INCREASING THE RELIABILITY OF A GATE OXIDE FILM

机译:埋入式栅电极的形成方法,能够通过增加栅氧化膜的可靠性来实现字线的低电阻

摘要

PURPOSE: A method for formation of a buried gate electrode is provided to prevent the deterioration of a gate oxide film by using a silicon germanium layer as the gate electrode layer contacting with the gate oxide film.;CONSTITUTION: A trench is formed inside a semiconductor substrate. A gate oxidation film(114) is formed on the semiconductor substrate having the trench. A first gate electrode layer(122) is formed on the gate oxidation film. A silicon layer is formed on the first gate electrode layer in order to fill up the trench. A part of the first gate electrode layer is selectively recessed in order to expose a part of the side of the silicon layer. A metal layer is formed on the semiconductor substrate having the part of the first gate electrode layer. A metal silicide layer(127) is formed on the top of the silicon layer by heat-treating the semiconductor substrate having a metal layer.;COPYRIGHT KIPO 2011
机译:目的:提供一种用于形成掩埋栅电极的方法,以通过使用硅锗层作为与栅氧化膜接触的栅电极层来防止栅氧化膜的劣化。组成:在半导体内部形成沟槽基质。在具有沟槽的半导体衬底上形成栅极氧化膜(114)。在栅氧化膜上形成第一栅电极层(122)。在第一栅电极层上形成硅层以填充沟槽。第一栅电极层的一部分被选择性地凹陷以便暴露硅层的侧面的一部分。在具有第一栅电极层的一部分的半导体衬底上形成金属层。通过对具有金属层的半导体衬底进行热处理,在硅层的顶部形成金属硅化物层(127)。COPYRIGHTKIPO 2011

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