首页> 外国专利> MICRO-MACHINING METHOD USING LASER INDUCED PLASMA TO PRECISELY MACHINE A TRANSPARENT SUBSTRATE

MICRO-MACHINING METHOD USING LASER INDUCED PLASMA TO PRECISELY MACHINE A TRANSPARENT SUBSTRATE

机译:利用激光诱导等离子体精密加工透明基质的微加工方法

摘要

PURPOSE: A micro-machining method using laser induced plasma is provided to reduce defects caused by fine crack in a transparent substrate and prevent damage due to thermal deformation, thermal transition and thermal strain.;CONSTITUTION: A micro-machining method using laser induced plasma comprises steps of: mounting a metal specimen in a laser machining device(S100), focusing a laser on the surface of the metal specimen(S200), positioning a transparent substrate between the laser and the metal specimen(S300), irradiating the laser onto the metal specimen to generate plasma(S400), and machining the back side of the transparent substrate with the plasma(S500).;COPYRIGHT KIPO 2011
机译:目的:提供一种使用激光诱导等离子体的微加工方法,以减少由透明基板中的细裂纹引起的缺陷,并防止由于热变形,热转变和热应变而造成的损坏。;构成:使用激光诱导等离子体的微加工方法包括以下步骤:将金属样品安装在激光加工设备中(S100),将激光聚焦在金属样品的表面上(S200),将透明基板放置在激光和金属样品之间(S300),将激光照射到金属标本产生等离子(S400),并用等离子对透明基板的背面进行加工(S500)。; COPYRIGHT KIPO 2011

著录项

  • 公开/公告号KR20100118229A

    专利类型

  • 公开/公告日2010-11-05

    原文格式PDF

  • 申请/专利权人 LEE BONG GU;

    申请/专利号KR20090036947

  • 发明设计人 LEE BONG GU;

    申请日2009-04-28

  • 分类号B23K10/00;B23K26/02;H01L21/3065;

  • 国家 KR

  • 入库时间 2022-08-21 18:31:39

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