首页> 外国专利> Full-wavelength ultrasonic welder of horizontal vibration type, and ultrasonic bonding apparatus having the same

Full-wavelength ultrasonic welder of horizontal vibration type, and ultrasonic bonding apparatus having the same

机译:水平振动型全波长超声波焊接机及具有该超声波焊接机的超声波焊接装置

摘要

A half wave length ultrasonic wave welding machine and an ultrasonic bonding device including the same are provided to make the replacement of a tool horn and the correction of planarity facilitated by having a slop on the one protruding side of the tool horn. An ultrasonic bonding device(200) including a half wave length ultrasonic wave welding machine comprises: a chip feeding unit(230) installed at one side of a table(220) in order to supply a chip; a stage unit(240) installed at the other one side of the table in order for a substrate having the chip to be settled; a feeding unit horizontally movable, established in the table in order to move the location of the substrate and to fix the substrate; a head unit(260) including a full spectrum ultrasonic-wave welding machine(100) of a transversal vibration mode; and a pick up unit transferring the chip to the full spectrum ultrasonic-wave welding machine of the transversal vibration mode.
机译:提供一种半波长超声波焊接机和包括该半波长超声波焊接机的超声波焊接装置,以通过替换在工具焊头的突出侧上具有斜度而方便地更换工具焊头并进行平坦度的校正。一种包括半波长超声波焊接机的超声焊接装置(200),包括:芯片进给单元(230),其安装在工作台(220)的一侧以供应芯片;以及载物台单元(240),其安装在工作台的另一侧,以使具有芯片的基板沉降。在工作台上可水平移动的进给单元,以移动基板的位置并固定基板;头单元(260)包括横向振动模式的全光谱超声波焊接机(100)。拾取单元将芯片传送至横向振动模式的全谱超声波焊接机。

著录项

  • 公开/公告号KR100950977B1

    专利类型

  • 公开/公告日2010-04-01

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20070105191

  • 申请日2007-10-18

  • 分类号B23K20/10;

  • 国家 KR

  • 入库时间 2022-08-21 18:31:19

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