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Method for manufacturing insulating sheet and method for manufacturing laminated plate clad with metal foil and printed circuit board thereof using the same

机译:绝缘片的制造方法以及使用金属箔包覆的层压板的制造方法及其印刷电路板

摘要

Insulation sheet production method and a metal-clad laminate and printed circuit board manufacturing method using the same are disclosed. Insulation sheet comprising the step of heating and pressing a thermoplastic resin layer on the step and the reinforcing base material to laminate the thermoplastic resin layer in the reinforcing base material is, it is possible to create near the insulating substrate to the thermal expansion coefficient of the semiconductor chip on the printed circuit board using the same it is possible to prevent bending or twisting, does not generate a stress to the connection member with the semiconductor chip and the printed circuit board, may have no cracks or peeling-off of the connection member, such as a lead-free solder. ; The reinforcing base material, the thermoplastic resin layer, heating and pressing, the organic fiber, the liquid crystal polyester resin
机译:公开了绝缘片的制造方法以及覆金属层压板和使用其的印刷电路板的制造方法。包括在该步骤中加热和压制热塑性树脂层的步骤的绝缘片和增强基材,以将热塑性树脂层层压在增强基材中,可以在绝缘基板附近产生相对于热膨胀系数的绝缘片。使用该芯片的印刷电路板上的半导体芯片可以防止弯曲或扭曲,不对半导体芯片和印刷电路板的连接构件产生应力,可以没有连接构件的裂纹或剥离,例如无铅焊料。 ;补强基材,热塑性树脂层,加热加压,有机纤维,液晶聚酯树脂

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