首页> 外国专利> Electroplating appartus and Trivalent chromium alloy electroplating solution for amorphous Trivalent chromium alloy electroplating layer

Electroplating appartus and Trivalent chromium alloy electroplating solution for amorphous Trivalent chromium alloy electroplating layer

机译:用于非晶态三价铬合金电镀层的电镀设备和三价铬合金电镀液

摘要

PURPOSE: A plating device for forming an amorphous trivalent chromium alloy plating layer and amorphous trivalent chromium alloy plating solution for the same are provided to reduce raw material cost and improve efficiency. CONSTITUTION: A plating device comprises a square drum-shaped electroplating bath(10), an ion diaphragm(20), a diaphragm(30), a rectifier(40), trivalent chrome alloy plating solution(50), and dilute sulfuric acid solution(60). A cathode ray(11) is interlinked to a substrate(12) forming a copper-electroplated layer on the inner center of the electroplating bath. An insoluble anode(14) interlinks to an anode ray(13) on the outside of the electroplating bath. The dilute sulfuric acid solution and ion pass through the ion diaphragm which is divided into a cathode(10a) and an anode(10b). The diaphragm is formed on the both sides of the ion diaphragm and supports the ion diaphragm. The rectifier is connected to the cathode ray and the anode ray and supplies electricity.
机译:用途:提供用于形成非晶态三价铬合金镀层的镀覆装置和用于该非晶态三价铬合金镀层的非晶态三价铬合金镀覆溶液,以降低原材料成本并提高效率。组成:一种电镀装置,包括方鼓形电镀液(10),离子膜片(20),膜片(30),整流器(40),三价铬合金镀液(50)和稀硫酸溶液(60)。阴极射线(11)与基板(12)交联,该基板在电镀浴的内部中心形成镀铜层。不溶性阳极(14)链接到电镀浴外部的阳极射线(13)。稀硫酸溶液和离子通过离子膜,该离子膜分为阴极(10a)和阳极(10b)。隔膜形成在离子隔膜的两侧并支撑离子隔膜。整流器连接到阴极射线和阳极射线并供电。

著录项

  • 公开/公告号KR100977068B1

    专利类型

  • 公开/公告日2010-08-19

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20100006294

  • 发明设计人 한용순;김선요;

    申请日2010-01-25

  • 分类号C25D17;C25D21/22;C25D3/06;C25D17/12;

  • 国家 KR

  • 入库时间 2022-08-21 18:30:54

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