首页> 外国专利> METHOD FOR PRODUCING THERMOSETTING RESIN, THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING SAME, MOLDED BODY, CURED BODY, AND ELECTRONIC DEVICE CONTAINING THOSE

METHOD FOR PRODUCING THERMOSETTING RESIN, THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING SAME, MOLDED BODY, CURED BODY, AND ELECTRONIC DEVICE CONTAINING THOSE

机译:制备热固性树脂,热固性树脂,包含相同成分的热固性组合物,模制体,固化体和包含这些的电子设备的方法

摘要

The present invention has excellent heat resistance and excellent electrical characteristics and significantly improved brittle thermosetting resin and the provision of the method and the thermosetting resin obtained in one of the object accordingly. The present invention, a) to the thermosetting resin having a polyfunctional phenol compound represented by the general formula I, b) a diamine compound represented by the formula II, and c) is heated to react, dihydrobenzoxazine jinhwan structure aldehyde compound provides a method ; & . Formula I & ; & Formula II & ; [wherein, X is an organic group having a carbon number of 6 or more, Y is an organic group having 5 or more comprises an aromatic ring, X and Y all of which as a hetero atom N, O, and may have a F, X, each of the benzene rings on both sides Y X, binds to a different atom in Y]
机译:本发明具有优异的耐热性和优异的电特性,并且显着改善了脆性的热固性树脂,并且相应地提供了一种目的提供的方法和获得的热固性树脂。本发明,a)对具有通式I表示的多官能酚化合物的热固性树脂,b)将通式II表示的二胺化合物,和c)加热反应,提供二氢苯并恶嗪金焕结构醛化合物的方法; &。 <式I> ; & <式II> ; [其中,X是碳原子数为6以上的有机基团,Y是碳原子数为5以上的有机基团,包括芳环,X和Y均作为杂原子N,O,并且可以具有F ,X,YX两侧的每个苯环均与Y中的另一个原子键合]

著录项

  • 公开/公告号KR100977927B1

    专利类型

  • 公开/公告日2010-08-24

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20087020225

  • 申请日2007-02-20

  • 分类号C08G14/073;C08G14/04;C08L61/18;

  • 国家 KR

  • 入库时间 2022-08-21 18:30:56

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